Quantum Process Integration Lead (BEOL)
QuantWare
Delft
3 days ago
Quantum Process Integration Lead (BEOL)
QuantWare is seeking a Quantum Process Integration Lead (BEOL) to develop back-end fabrication and assembly technologies for quantum processors in Delft. The role requires 4+ years of experience in chip assembly development and expertise in flip chip bonding, UBM, bumps, and related technologies. The company offers competitive salary, pension, hybrid flexibility, relocation support, and personal growth opportunities.
On-site
Full-time
Mid Level
Flip Chip Bonding
UBM
Salary
Not specified
Core Qualifications
Technical (Must-have)
flip chip bondingUBMhard-stopsbumpsdetachable contactsMEMSflip-chip technologiesquantum computing
Soft Skills
leadershipcollaborationproblem solvinginvestigation
Preferred Qualifications
Technical (Nice-to-have)
superconducting qubits
Key Responsibilities
- Plan and lead development of back-end fabrication and assembly technologies, focusing on flip chip bonding, contacts reliability, and manufacturability.
- Develop and coordinate integration test plans with cross-functional teams.
- Lead definition and formalisation of assembly-centric fabrication and process development.
- Establish scalable, well-documented integration procedures.
- Investigate and resolve integration issues and technical anomalies.
quantum computingprocess integrationBEOLflip chipfabricationassemblyDelfthardwarefull-timeonsite