Delft
4 May 2026
Senior 3D Packaging & Tooling Engineer
QuantWare
Delft
4 May 2026
Senior 3D Packaging & Tooling Engineer
QuantWare is seeking a Senior 3D Packaging & Tooling Engineer to lead the physical realization of VIO quantum processors in Delft, Netherlands. The role involves tooling adaptation, advanced process development, non-standard 3D assembly, and vendor management, with 7+ years of experience in high-accuracy semiconductor assembly.
HybridFull-timeSeniorFlip-chip BondersDie Attaches
Senior 3D Packaging & Tooling Engineer
QuantWare is seeking a Senior 3D Packaging & Tooling Engineer to lead the physical realization of VIO quantum processors in Delft, Netherlands. The role involves tooling adaptation, advanced process development, non-standard 3D assembly, and vendor management, with 7+ years of experience in high-accuracy semiconductor assembly.
HybridFull-timeSeniorFlip-chip Bonders
Salary
Not specified
Core Qualifications
Technical (Must-have)
flip-chip bondersdie attachesthermo-compression bondinglaser-assisted bondingcoldweldingTSVsmicro-bumpsinterposerssoldersunderfills
Key Responsibilities
- Lead the modification and customization of high-precision assembly equipment (e.g., flip-chip bonders, die attaches) to meet unique quantum 3D integration requirements
- Develop sub-micron placement and bonding processes (thermo-compression bonding, laser-assisted bonding, coldwelding) for non-standard substrates
- Lead the evaluation of glues, adhesives, and solder materials
- Design and execute out-of-the-box integration strategies, including multi-die stacking, interposer-based 3D architectures, and orthogonal (vertical) chip placement
- Interface directly with equipment manufacturers to drive co-development of specialized hardware
3D PackagingTooling EngineerQuantum ComputingSemiconductorFlip-chipHybridSeniorFull-timeEngineeringDelft