6 May 2026

Quantum Process Integration Lead (BEOL)

QuantWare

Delft

6 May 2026

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QuantWare is seeking a Quantum Process Integration Lead (BEOL) to develop back-end fabrication and assembly technologies for quantum processors in Delft. The role requires 4+ years of experience in chip assembly development and expertise in flip chip bonding, UBM, bumps, and related technologies. The company offers competitive salary, pension, hybrid flexibility, relocation support, and personal growth opportunities.

On-siteFull-timeMid LevelFlip Chip BondingUBM

Quantum Process Integration Lead (BEOL)

Apply

On-siteFull-timeMid LevelFlip Chip Bonding

Salary

Not specified

Work Location

Delft, South Holland, Netherlands, NL

Work Model

On-site

Experience Required

4 years

Employment Type

Full-time

Experience Level

4+ years of experience

Core Qualifications

Technical (Must-have)

flip chip bondingUBMhard-stopsbumpsdetachable contactsMEMSflip-chip technologiesquantum computing

Soft Skills

leadershipcollaborationproblem solvinginvestigation

Preferred Qualifications

Technical (Nice-to-have)

superconducting qubits

Key Responsibilities

•Plan and lead development of back-end fabrication and assembly technologies, focusing on flip chip bonding, contacts reliability, and manufacturability.
•Develop and coordinate integration test plans with cross-functional teams.
•Lead definition and formalisation of assembly-centric fabrication and process development.
•Establish scalable, well-documented integration procedures.
•Investigate and resolve integration issues and technical anomalies.

quantum computingprocess integrationBEOLflip chipfabricationassemblyDelfthardwarefull-timeonsite

Key Responsibilities

•Plan and lead development of back-end fabrication and assembly technologies, focusing on flip chip bonding, contacts reliability, and manufacturability.

•Develop and coordinate integration test plans with cross-functional teams.

•Lead definition and formalisation of assembly-centric fabrication and process development.

•Establish scalable, well-documented integration procedures.

•Investigate and resolve integration issues and technical anomalies.